SiCSem, a power electronics chip company, held a groundbreaking ceremony on Saturday for the establishment of India’s first end-to-end silicon carbide (SiC) semiconductor production plant in Odisha. The facility, with an investment of approximately Rs 20 billion, is slated to begin operations by 2027–28. Once operational, the plant will have the capacity to process 60,000 SiC wafers annually and package around 96 million units.

Silicon carbide chips are critical in handling high-voltage applications and are extensively used in sectors such as renewable energy, electric vehicles, and power inverters. The project is expected to strengthen India’s semiconductor manufacturing capabilities and enhance its position in the global electronics supply chain.

At the event, Odisha Chief Minister Mohan Charan Majhi, along with Electronics and IT Minister Mukesh Mahaling and senior state officials, expressed support for the project. SiCSem Pvt Ltd Managing Director Guru Thalapaneni highlighted the significance of the integrated facility, emphasizing its potential to contribute to India’s growing electronics sector.

The SiC chip project was approved by the Indian Cabinet on August 12. Under Prime Minister Narendra Modi’s leadership, India’s electronics industry has experienced a remarkable sixfold growth over the last 11 years, with electronics exports increasing eightfold over the same period.

SiCSem is a subsidiary of Archean Chemical Industries, which aims to boost India’s manufacturing capacity in critical technologies like silicon carbide chips, essential for powering future technologies.

(Source: ET Manufacturing)