ASI Test Lab Pvt Ltd offers a monitoring system for ‘Burn in’ of auto-electronic assemblies. The term ‘Burn in’ is conventionally used for subjecting electronic component or assembly to electrical and environmental stress. The purpose of ‘Burn in’ is to detect any early failure in the life of component or assembly. In case of automobile components/assemblies, parts are subjected to this stress for specific amount of time duration to match its real life application. The following are main areas of probable defects in electronic assembly, which surface during ‘Burn in’ stress: basic electronic component failure due to elevated temperature during stress (reversed biased junctions); power electronic component failures with defect in heat sink assembly (thermal runaway); malfunction of entire assembly due to dry solders; failure in performance due to permanent drift in parameters of some of electronic components in assembly; and failure/malfunction due to hairline crack in PCB tracks. The new system designed at ASI is equipped with continuous monitoring of status of device under ‘Burn in’. This is an important feature to detect intermittent malfunctioning of device under test.
ASAPP INFO GLOBAL SERVICES PVT. LTD A-303, Navbharat Estate, Zakaria bunder Road, Sewri(West), Mumbai-400 015, Maharashtra, India.
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